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Laser Cutting

Intelligent leadframe separation

In semiconductor industry lasers are used for leadframe cutting or hybrid cutting processes. The scanner-based cutting technology is fast and flexible enough to interact closely with preceding functional tests. With extremely small kerf widths even the tiniest lead structures can be processed.

Separation of certain highly integrated packagings, like QFN packages, requires cutting of composite material - e.g. leadframe and mold compound. A combination of soft and hard material which makes mechanical sawing slow and prone to wear. In contrast, hybrid cutting with ROFIN‘s lasers opens up new vistas for clean and fast cutting of this type of composite materials.

Miniaturized memory cards (µSD) require cutting of irregular shapes. The half-cut technology, a combination of laser and mechanical saw, offers higher performance and less surface roughness than conventional methods.

Laser Cutting of Matrix Lead Frames

Laser Cutting of Matrix Lead Frames

The laser based separation leaves faulty components in the lead frame.

 

For this application we recommend: PowerLine D

Laser Cutting of µSD Card

Laser Cutting of µSD Card

Compared to water jet cutting, laser cutting is three times more cost-effective at comparable performance. End pumped lasers with 532 nm wavelength achieve best cutting quality.


For this application we recommend: PowerLine E