Laser Cutting in the Electronic Industry

Flexible and Suitable for Composites

Because of their large range of beam sources, ROFIN offers an efficient cutting solution for almost every material in the electronic industry. Beam deflection with galvo scanning heads allows any complex contours that can be reprogrammed to be cut in the shortest time. As opposed to other cutting processes, the laser cannot wear out, which assures the continuous processing quality that is so important for steady production process.

Laser Cutting of µSD Cards

Laser Cutting of µSD Cards

Compared to water jet cutting, laser cutting is three times more cost effective at comparable performance. End pumped lasers with 532 nm wavelength achieve the best cutting quality

 

For this application we recommend: PowerLine E

Laser Cutting of Circuit Boards

Laser Cutting of Circuit Boards

Quick and precise cutting of fiber optic reinforced synthetic resin plates with a CO2 laser.

 

For these applications we recommend: StarFemto FX, StarShape

Laser cutting of metal

Laser cutting of metal

Precise laser cutting of smallest metal workpieces for the electronic industry.

 

For this application we recommend: StarFemto FXStarFiber, StarPulse



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