Laser Cutting of Glass

Wide Processing Spectrum

Cutting glass with conventional, mechanical methods like diamond scribing and breaking comes with significant drawbacks due to relatively low scribing quality (micro-cracks, chipping) and accuracy. Typically, a number of additional time-consuming processing steps like grinding, masking and etching are necessary to remove the damage that had been introduced by mechanical processes, as well as to eventually achieve the required tolerance of the parts outer dimensions.

By using a laser for the glass cutting process, before mentioned disadvantages can be avoided. Depending on the composition and the requirements e.g. concerning the cutting edge quality, we offer different lasers for glass cutting.

When producing sensitive components which often require the cutting of flexible thin-glass or light and high-strength glass e.g. within the electronic industry, the SmartCleaveTM FI process is the right choice.

SmartCleave™ FI is a kerf-less separation process for strengthened (chemically and thermally) and non-strengthened glass of 100 µm to 10 mm thickness and other brittle materials. It achieves greater 300 mm/s cutting speed. Straight, curved, angled and chamfered contours are possible as well as cutting of tubular or curved parts or stacks. SmartCleave™ FI offers unmatched cutting quality with minimal micro-cracking and chipping and a surface roughness of Ra < 1µm. Parts cut with SmartCleave™ FI retain high bend strength and require minimal post-processing.

When cutting larger glass thicknesses or if sharp glass edges should be avoided e.g. in the drinking glass manufacturing, CO2 lasers are recommended for the cutting process. During the cutting process with CO2 lasers the cutting edges are slightly molten and therefore rounded.

Glass Cutting for Mobile Device Displays

Glass Cutting for Mobile Device Displays

Flat glass scribe and break processes are traditionally used to mechanically separate glass. This process very often does not allow to avoid micro cracks and chipping along the scribe line, significantly influencing the bending strength of glass substrates. Our SmartCleaveTM FI process allows cutting arbitrary shapes including small radii of down to 2 mm in a single pass without taper. The resulting surface finish is basically free of chipping.


For the SmartCleaveTM FI cutting application we recommend: MPS with StarFemto FX.


Visit our microsite to read more about the SmartCleaveTM FI cutting process


SmartCleave FI-Product-Flyer
Brochure: Laser Glass Processing

Cutting of Drinking Glasses

Cutting of Drinking Glasses

For glass cutting processes such as the cutting of drinking glasses, CO2 laser of different power classes can be used.

For this application we recommend: DC Series