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Laser-Glasschneiden

Deflashing / Decapping

Correction of Manufacturing Flaws of and Failure Analysis

Excess encapsulation material on unmolded surfaces, can have serious negative impact on proper functioning. Mold flash between individual leads can be hazardous to safe contacting. Excess mold compound around heat sinks inhibits accurate mounting for optimum thermal conduction. Laser deflashing systems use integrated pattern recognition to identify crucial areas and remove excess mold with a diode pumped solid state laser.

Decapping is a precisely controlled laser process which ablates layers of the molding compound and reveals the inner structures for failure analysis. Compared to chemical cauterizing or other procedures, the laser allows selective  ablation of certain areas and removing of the compound underneath the wiring.

Deflashing

Deflashing

Removing mold flash from leads

Decapping

Decapping



Unpacking IC packages