Laser Cutting in the Electronic Industry

Flexible and Suitable for Composites

Due to the large range of beam sources for almost every material in the electronic industry there is an efficient cutting solution. The beam deflection with galvo scanning heads allows any complex cutting contours that can be reprogrammed within shortest time. The special laser micro fused material let the separating border appear optically appealing and avoids micro cracking. As opposed to other cutting processes, the laser cannot wear out, which assures the continuous processing quality that is important for the steady production process.

The laser based cutting of composites is above all ecological and cost-effective. The normally used jet cutting requires an immense effort to gain an ecological conditioning of the cutting water that contains abrasive particles. Furthermore, there are maintenance and repair costs.

Laser Cutting of Sprues

Laser Cutting of Sprues

A good example for the use of lasers is the cutting of spues for separating PMMA keyboards for mobile phones.

 

For these applications we recommend: StarShape

Laser Cutting of µSD Cards

Laser Cutting of µSD Cards

Compared to water jet cutting, laser cutting is three times more costeffective at comparable performance. End pumped lasers with
532 nm wavelength achieve best cutting quality

 

For this application we recommend: PowerLine E

Laser Cutting of Circuit Boards

Laser Cutting of Circuit Boards

Quick and precise cutting of fiber optic reinforced synthetic resin plates with a CO2 laser.

 

For these applications we recommend: StarShape

Toolbox
ROFIN Worldwide
05.02. - 09.02.2012
Spring Fair
Birmingham, UK
Booth 18M75
07.02. - 09.02.2012
SEMICON Korea
Seoul, Korea
Booth 2404