Laser Cutting of Other Materials

Wide Processing Spectrum

Besides metals, a wide variety of other materials can be laser cut: semiconductors, plastics, organic materials, ceramics, paper, glass, graphite, diamonds and also composite materials.

Laser Cutting of Silicon

Laser Cutting of Silicon

Mono and poly-crystalline silicon wafers can be cut at high speeds with very high preciseness and low heat input using the same ablation process as for edge isolation and drilling. New methods have shown that the so-called multi-pass separation process, without using cutting gas, produces edges with a better surface quality than using the single cut separation applying a coaxial gas beam.

For this application we recommend: StarDisc, StarFiber


Laser Cutting of Plastics

Laser Cutting of Plastics

Thermoplastic plastics such as plexiglass or thermoplastic can already be cut by sublimation with CO2 lasers at quite low power rates of 100 to 300 watts. Depending on the application, cuts of polished wall quality can be realized (optically clear cutting edge). A major field of application of such laser cut parts is illuminated advertising. 


For this application we recommend: SC Series, OEM Series, DC Series

Laser Cutting of Wood

Laser Cutting of Wood

One example for non-ferrous cutting applications with lasers is the cutting of wood for the application in die making. Applied are CO2 lasers as the radiation of other laser types is not absorbed by this material. Especially the flexibility of laser cutting in combination with the high accuracy and quality of the kerfs are the reasons that make laser cutting interesting for these applications. Later CNC-bended knives are inserted into the kerfs, which cut the desired packaging or paperboard containers. Typical processing speeds of the laser are according to the material strengths between 1.5 and 4 m /min. 

For this application we recommend: SC Series, OEM-Serie, DC Series

Laser Cutting of Paper

Laser Cutting of Paper

When cutting paper usually – process-related – a CO2 laser with high beam quality is used. Through the connection to a galvo scanning head one can achieve a high flexibility as well as a high process speed of more than 2000mm/s. Additionally, the cutting quality is normally significantly better than compared to the mechanical separating by die cutting or a rotary fabric cutter. Moreover, a specific control technology allows the cutting with an on-the-fly technique. That means that the ribbon shaped material can be processed in-line without speed disruption. As the applied lasers are quickly modulated, besides continuous cuts also micro-perforations can be applied. Examples for cases, in which today paper, screens or etiquettes are cut via lasers serially, are self-adhesive etiquettes, variably designed gift cards or prototypes medial quantities.

For this application we recommend: SC Series, OEM SeriesSealed-off CO2 laser - Laser cutting - SC Series

Laser Cutting of Ceramics

Laser Cutting of Ceramics

Ceramic is usually separated with the help of q-switched solid-state lasers and performances between 1 and 300 Watt for sublimation cutting. As the cutting depths in one cycle (single pass) is often only within the range of a few 10 micrometers, bigger material strengths are separated in the so called multi-pass process.

For this application we recommend: PowerLine E Series, PowerLine D 100 Series

Laser Cutting of Glass

Laser Cutting of Glass

In most cases, flat glass has traditionally been separated by scribing and subsequent breaking. During this procedure, glass splinters and micro cracks may occur along the separating line thus decreasing the bending strength of glass substrates considerably.

 

With the patented MLBA-process the laser beam is absorbed homogenously in the glass by multi-reflection. When the laser radiation heats the glass a pre-defined tension can be induced in the glass and thus creating a clean cut. After an initial fissure the glass is cut by a thermally induced tension in one step (full body cut). This contact-free process creates contour cuts with outstanding edge quality. The MLBA procedure can also be applied for many coated glass panels and several glass panels can also be cut simultaneously in a single operation step.

 

For this application we recommend: DQ Series

Laser Cutting of Memory Metals

Laser Cutting of Memory Metals

Medical stents made of stainless steel or nickel-titan-alloys (shape memory alloys or memory metals) are support implants with a geometry that is cut out of a tube and which requires excellent quality. Typical tube diameters ranges from1 and 30 mm with a wall thickness of 50 - 600 microns. Laser cutting allows cuts smaller than 20 microns wide at cutting speeds of several mm/sec. In this way a stent can be produced within only few minutes.

For this application we recommend: StarCut Tube

Laser Cutting of Textiles

Laser Cutting of Textiles

Due to the product variety in automobile production and associated manufacturing processes, increasingly basic components of the automobile interior lining are cut individually. Such as for wood or leather or homogenous and fiber-reinforced plastics, the process of sublimation cutting is favored for textiles. Usually, CO2 lasers with a performance of 300 Watt are applied, which are able to separate composite materials such as textiles with a speed of up to 5m/min. A significant advantage is the melting of textile fibers due to the thermal separation process so that fibers do not frazzle anymore in opposite to mechanical separation processes. This advantage is also used when separating airbag cloth and apparel fabric. Here, mainly multi-layer materials are cut with higher performances. For the cutting of airbag cloth CO2 lasers with performances of up to 1.5 kW are applied.

For this application we recommend: SC Series, OEM Series, DC Series

Laser Cutting of Diamonds

Laser Cutting of Diamonds

During the process called sublimation cutting the material is melted on through the absorbed laser energy and partly evaporated immediately, without going through the liquid condition of aggregation (sublimation). Since the resulting steam is pressurized, removed material is affected by ejection from the kerf against the beam impact direction.

 

For this application we recommend: PowerLine E Series, PowerLine D 100 Series

Toolbox
ROFIN Worldwide
05.02. - 09.02.2012
Spring Fair
Birmingham, UK
Booth 18M75
07.02. - 09.02.2012
SEMICON Korea
Seoul, Korea
Booth 2404